Loading patent…
AssigneeDenso Corporation
InventorsHayato Kiuchi, Atsushi Furumoto, Kazuyuki Hamamoto, Teruhiko Iwase, Masayuki Fujihira
Estimating the term…
A sleeve soldering device has a displacement sensor and a heat flux sensor. The displacement sensor detects a physical quantity related to a pressure from a heated sleeve heated by a heater onto an electric board when the heated sleeve presses the electric board. The displacement sensor detects a physical quantity related to a deformation amount of the electric board due to thermal energy from the heater. The heat flux sensor detects a physical quantity related to a heat transfer amount from the heater to the electric board when the heated sleeve is pressed to the electric board. A control part compares each of detection values obtained from the displacement sensor and the heat flux sensor with a respective judgment reference so as to detect whether each detection value satisfies the respective reference.
A sleeve soldering device performing a soldering process of a terminal of an electronic component and a terminal of an electric board, comprising:
A computer implemented method of manufacturing an electronic device composed of an electronic component and an electric board, the method performing a soldering process between a terminal of the electronic component and a terminal of the electric board sleeve by using a sleeve soldering device comprising a sleeve in which a through hole is formed, a movement mechanism and a heater heating the sleeve, wherein a solder is fed into the through hole of the sleeve, the movement mechanism moves the sleeve,
Dependencies are inferred from the claim text.