Method of manufacturing electronic devices and corresponding electronic device

An electronic device, comprising:

• a substrate having electrically-conductive tracks patterned thereon;
• a semiconductor chip arranged on said substrate, wherein the semiconductor chip is electrically coupled to selected ones of said electrically-conductive tracks;
• containment structures at selected locations on said electrically-conductive tracks, wherein each containment structure has a perimeter wall which defines a cavity, said cavity having a size and shape configured to accommodate a base portion of a pin holders;
• and
• pin holders soldered within the cavities defined by said containment structures on said electrically-conductive tracks.

A method, comprising:

• providing a substrate having electrically-conductive tracks;
• arranging a semiconductor chip on the substrate and electrically coupling to selected ones of said electrically-conductive tracks;
• attaching the substrate to a base plate;
• providing a set of alignment marks on one or more of said base plate and said substrate, wherein the set of alignment marks are indicative of reference positions;
• providing pads of resist material at said selected locations on said electrically-conductive tracks;
• based on said reference positions, selectively removing resist material from inner portions of said pads to respectively form perimeter walls of containment structures which define cavities;
• and
• soldering said pin holders within said cavities defined by said containment structures on said electrically-conductive tracks;
• wherein said cavitied have a size and shape configured to accommodate a base portion of the pin holder.