H05K 2203/0425
Solder powder or solder coated metal powder
H05K2203/0425 (Solder powder or solder coated metal powder) appears on 194 US grants and 185 published applications in this corpus.
Search patents in H05K- Granted patents
- 194
- Published applications
- 185
- Assignees
- 102
- Inventors
- 453
- Latest grant
- 1 Oct 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 5 | 0 |
| 1995 | 5 | 0 |
| 1996 | 6 | 0 |
| 1997 | 3 | 0 |
| 1998 | 10 | 0 |
| 1999 | 5 | 0 |
| 2000 | 7 | 0 |
| 2001 | 6 | 4 |
| 2002 | 6 | 10 |
| 2003 | 6 | 5 |
| 2004 | 6 | 7 |
| 2005 | 6 | 7 |
| 2006 | 3 | 9 |
| 2007 | 5 | 16 |
| 2008 | 6 | 17 |
| 2009 | 6 | 21 |
| 2010 | 13 | 12 |
| 2011 | 14 | 11 |
| 2012 | 9 | 10 |
| 2013 | 9 | 10 |
| 2014 | 9 | 10 |
| 2015 | 5 | 6 |
| 2016 | 7 | 6 |
| 2017 | 8 | 7 |
| 2018 | 4 | 4 |
| 2019 | 3 | 3 |
| 2020 | 8 | 5 |
| 2021 | 1 | 1 |
| 2022 | 2 | 1 |
| 2023 | 2 | 2 |
| 2024 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Ceramic substrate manufacturing method1 Oct 2024US 12,108,540 B2Amosense Co., Ltd.
- Bonding member and bonding method21 Nov 2023US 11,819,915 B2Murata Manufacturing Co., Ltd.
- Resin flux solder paste and mount structure11 Apr 2023US 11,623,307 B2Panasonic Intellectual Property Management Co., Ltd.
- Ceramic circuit board and production method therefor25 Oct 2022US 11,483,926 B2Denka Company Limited
- Method for flip-chip bonding using anisotropic adhesive polymer1 Feb 2022US 11,240,918 B2Research & Business Foundation Sungkyunkwan University
- Method of manufacturing bonded substrate, method of manufacturing circuit substrate, and circuit substrate28 Mar 2024US 2024/0107678 A1Ngk Electronics Devices, Inc.
- Tolerance compensation element for circuit configurations15 Jun 2023US 2023/0189450 A1Siemens Aktiengesellschaft
- Method for producing a via in a carrier layer produced from a ceramic and carrier layer having a via4 May 2023US 2023/0137460 A1Rogers Germany GmbH
- Ceramic substrate manufacturing method28 Jul 2022US 2022/0240389 A1Amosense Co., Ltd.
- Resin flux solder paste and mount structure18 Nov 2021US 2021/0354251 A1Panasonic Intellectual Property Management Co., Ltd.
Most cited
By later US patents
- Rigid-flex board with anisotropic interconnect and method of manufacture175US 5,428,190 ASheldahl, Inc. · 1995
- Multilayer printed circuit154US 5,716,663 AToranaga Technologies, Inc. · 1998
- Method of forming an adhesive connection136US 6,077,380 AMicroFab Technologies, Inc. · 2000
- Electrically and thermally conductive adhesive transfer tape128US 4,606,962 AMinnesota Mining and Manufacturing Company · 1986
- Vertically interconnected electronic assemblies and compositions useful therefor111US 5,948,533 AOrmet Corporation · 1999