Method for producing a via in a carrier layer produced from a ceramic and carrier layer having a via
AssigneeRogers Germany GmbH
InventorsKarsten Schmidt, Stefan Britting, Andreas Meyer, Rainer Herrmann, Martin Reger
Life of this patent
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Abstract
A method for making a via (3) in a carrier layer (1) made of a ceramic comprising: providing the carrier layer (1), realizing a passage recess (2) in the carrier layer (1), at least partially filling the passage recess (2) with a paste (3), and performing a bonding process, in particular an active soldering process or a DCB process, for bonding a metallization (5) to the carrier layer (1), the via (3′) being realized from the paste (3) in the passage recess (2) when the bonding process is performed.
Claims14
A method for forming a via (3) in a carrier layer (1) made of a ceramic comprising:
- providing the carrier layer (1),
- realizing a passage recess (2) in the carrier layer (1),
- at least partially filling the passage recess (2) with a paste (3), and
- performing a bonding process by means of an active soldering process or a DCB process for bonding a metallization (5) to the carrier layer (1), the via (3′) being realized from the paste (3) in the passage recess (2) when the bonding process is performed.
The method according to wherein the via (3′) is formed as a coating of the inner side (9) of the via (2) having a coating thickness (D1), the bonding process being configured such that a certain coating thickness is obtained.
Dependencies are inferred from the claim text.