Ceramic substrate manufacturing method
AssigneeAmosense Co., Ltd.
InventorsKyung Whan WOO, Ji Hyung LEE
Life of this patent
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Abstract
Disclosed is a ceramic substrate manufacturing method in which a copper sheet is etched and then bonded to a ceramic substrate, so that the ceramic substrate has reduced to overall processing time and improved reliability and product lifespan. The disclosed ceramic substrate manufacturing method comprises the steps of: etching a copper sheet so as to prepare a metal substrate; etching a ceramic substrate so as to prepare a unit ceramic substrate; assembling the metal substrate and the unit ceramic substrate; bonding the metal substrate and the unit ceramic substrate so as to form a stack; partially printing a metal paste on the surface of the stack; and sintering the metal paste.
Claims8
A ceramic substrate manufacturing method, the method comprising:
- preparing a metal substrate by etching a copper sheet;
- preparing a unit ceramic substrate by etching a ceramic substrate;
- assembling the metal substrate and the unit ceramic substrate;
- forming a stack by bonding the metal substrate and the unit ceramic substrate;
- partially printing a metal paste on a surface of the stack;
- and
- sintering the metal paste.
A ceramic substrate manufacturing method, the method comprising:
- forming a plating substrate by plating a part of a copper sheet with a metal;
- preparing a metal substrate by etching the plating substrate;
- preparing a unit ceramic substrate by etching a ceramic substrate;
- and
- assembling the metal substrate and the unit ceramic substrate.
A ceramic substrate manufacturing method, the method comprising:
- disposing a spacer between ceramic substrates;
- and
- brazing and bonding the spacer and the ceramic substrates,
- wherein the disposing comprises disposing a spacer with a thermal conductivity and a coefficient of thermal expansion each equal to or greater than a reference value.
Dependencies are inferred from the claim text.