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US 11,819,915 B2Granted
Bonding member and bonding method
AssigneeMurata Manufacturing Co., Ltd.
InventorSeitaro Washizuka
Life of this patent
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Abstract
A bonding member that includes a resin body defining an airtight interior, and a bonding material enclosed in the interior of the resin body. The bonding material is a mixed powder that includes a plurality of particles of a first metal powder and a plurality of particles of a second metal powder. The second metal powder reacts with the first metal powder when melted to thereby produce an intermetallic compound. The resin body has a melting point higher than a softening point of the mixed powder.
Claims17
A bonding member comprising:
- a resin body comprising two resin films attached to each other so as to define an airtight interior;
- and
- a bonding material comprising multiple metal powders, and enclosed within the airtight interior defined by the two resin films,
- wherein the two resin films comprise a material having a melting point higher than a melting point of the multiple metal powders, and
- wherein the bonding material comprises no flux.
2 more elements
A bonding method comprising:
- disposing a bonding member between a first bonding object and a second bonding object, the bonding member comprising a resin body comprising two resin films attached to each other so as to define an airtight interior, and a bonding material comprising multiple metal powders enclosed within the airtight interior defined by the two resin films, the two resin films comprising a material having a melting point higher than a melting point of the multiple metal powders, and the bonding material comprising no flux;
- and
- applying, to the bonding member disposed between the first bonding object and the second bonding object, a heat treatment at a temperature at which the two resin films are melted.
Dependencies are inferred from the claim text.