H05K 2203/0485
Tacky flux
Official title: Tacky flux, e.g. for adhering components during mounting
H05K2203/0485 (Tacky flux) appears on 84 US grants and 64 published applications in this corpus.
Search patents in H05K- Granted patents
- 84
- Published applications
- 64
- Assignees
- 39
- Inventors
- 161
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 6 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 3 | 0 |
| 1996 | 4 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 5 | 1 |
| 2002 | 2 | 2 |
| 2003 | 1 | 0 |
| 2004 | 2 | 6 |
| 2005 | 2 | 7 |
| 2006 | 4 | 8 |
| 2007 | 2 | 6 |
| 2008 | 5 | 3 |
| 2009 | 5 | 11 |
| 2010 | 8 | 4 |
| 2011 | 4 | 1 |
| 2012 | 3 | 2 |
| 2013 | 1 | 0 |
| 2014 | 0 | 1 |
| 2015 | 1 | 3 |
| 2016 | 2 | 0 |
| 2017 | 1 | 1 |
| 2018 | 2 | 1 |
| 2019 | 0 | 2 |
| 2020 | 1 | 0 |
| 2021 | 0 | 2 |
| 2022 | 0 | 0 |
| 2023 | 2 | 0 |
| 2024 | 0 | 3 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Non-electroconductive flux, connected structure, and method for producing connected structure31 Mar 2026US 12,589,452 B2Sekisui Chemical Co., Ltd.
- Method of manufacturing electronic module, electronic module, and electronic device18 Apr 2023US 11,632,886 B2Canon Kabushiki Kaisha
- Resin flux solder paste and mount structure11 Apr 2023US 11,623,307 B2Panasonic Intellectual Property Management Co., Ltd.
- Fluxes effective in suppressing non-wet-open at BGA assembly25 Aug 2020US 10,756,039 B2Indium Corporation
- Intelligent inventory storage system14 Aug 2018US 10,045,636 B2Inovaxe Corporation
- Carrier structure, method for producing a carrier structure and device and printhead for carrying out such a method18 Jul 2024US 2024/0244760 A1ams-OSRAM International GmbH
- Non-electroconductive flux, connected structure, and method for producing connected structure11 Jul 2024US 2024/0227089 A9Sekisui Chemical Co., Ltd.
- Non-electroconductive flux, connected structure, and method for producing connected structure25 Apr 2024US 2024/0131633 A1Sekisui Chemical Co., Ltd.
- Resin flux solder paste and mount structure18 Nov 2021US 2021/0354251 A1Panasonic Intellectual Property Management Co., Ltd.
- Method of manufacturing electronic module, electronic module, and electronic device6 May 2021US 2021/0136967 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Method of forming solder terminals for a pinless ceramic module160US 4,830,264 AInternational Business Machines Corporation · 1989
- Fine pitch solder deposits on printed circuit board process and product138US 5,492,266 AInternational Business Machines Corporation · 1996
- Direct chip attachment structure and method131US 5,439,162 AMotorola, Inc. · 1995
- Method of bonding connecting pins to the eyelets of conductors formed on a ceramic substrate101US 4,462,534 AInternational Business Machines Corporation · 1984
- Method for solder application and reflow94US 5,255,839 AMotorola, Inc. · 1993