Method of bonding connecting pins to the eyelets of conductors formed on a ceramic substrate

Abstract

This method of bonding the heads of connecting pins previously inserted in a ceramic substrate to the eyelets of conductors formed on the top surface of said substrate comprises the steps of: applying a droplet of flux to the head of each pin; applying a solder ball to the head of each pin where it is held in position because of the adhesive capacity of the flux; heating in a furnace containing a nitrogen atmosphere and having a peak temperature of 350.degree. C. to cause a solder reflow; and allowing to cool to enable the solder to set and to provide a permanent electrical and mechanical bond between the head of the pins and the eyelets. This method is suitable for use in manufacturing electronic modules employed in computers.

Dependencies are inferred from the claim text.