Method for solder application and reflow

A method for soldering a component to a substrate, comprising the steps of;

• (a) providing a substrate having predefined solderable metal pads;
• (b) providing solder spheres for suitable placement on the solderable metal pads;
• (c) applying a flux and a tacking media to the solderable metal pads;
• (d) dipping the solder spheres in the flux;
• (e) placing the solder spheres on the solderable metal pads;
• (f) heating and melting the solder spheres onto the solderable metal pads of the substrate providing reflowed solder on the solderable metal pads;
• (g) applying a layer of flux tacking media on the reflowed solder;
• (h) placing a component on the reflowed solder and flux tacking media providing a circuit assembly;
• and
• (i) heating the circuit assembly allowing the component to become soldered to the solder pad.

A method for soldering a component to a substrate, comprising the steps of:

• (a) providing a substrate having predefined solderable metal pads;
• (b) providing solder spheres for suitable placement on the solderable metal pads;
• (c) applying a layer of flux to the solderable metal pads;
• (d) dipping the solder spheres in a tacking media;
• (e) placing the solder spheres on the solderable metal pads;
• (f) heating and melting the solder spheres onto the solderable metal pads of the substrate providing reflowed solder on the solderable metal pads;
• (g) applying a layer of flux tacking media on the reflowed solder;
• (h) placing a component on the reflowed solder and flux tacking media providing a circuit assembly;
• and
• (i) heating the circuit assembly allowing the component to become soldered to the solder pad.

A method for soldering a component to a substrate, comprising the steps of:

• (a) providing a substrate having predefined finely pitched solder pads, said solder pads being finished with a solderable material;
• (b) spraying a thin layer of flux over the substrate;
• (c) providing small diameter solder spheres for suitable placement on the solder pads;
• (d) dipping the solder spheres in a tacking media;
• (e) placing the solder spheres dipped in tacking media on the solder pads;
• (f) reflowing the solder spheres onto the solder pads of the substrate;
• (g) applying a layer of flux tacking media on the reflowed solder;
• (h) placing a fine leaded or pitched component on the reflowed solder and flux tacking media;
• and
• (i) reflowing the component and substrate allowing the component to be soldered to the solder pad.