H05K 2203/047
Soldering with different solders
Official title: Soldering with different solders, e.g. two different solders on two sides of the PCB
H05K2203/047 (Soldering with different solders) appears on 61 US grants and 79 published applications in this corpus.
Search patents in H05K- Granted patents
- 61
- Published applications
- 79
- Assignees
- 70
- Inventors
- 216
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 5 | 1 |
| 2003 | 0 | 1 |
| 2004 | 2 | 10 |
| 2005 | 5 | 4 |
| 2006 | 1 | 2 |
| 2007 | 7 | 3 |
| 2008 | 0 | 1 |
| 2009 | 2 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 5 |
| 2012 | 2 | 3 |
| 2013 | 0 | 5 |
| 2014 | 2 | 4 |
| 2015 | 2 | 4 |
| 2016 | 2 | 10 |
| 2017 | 7 | 3 |
| 2018 | 4 | 0 |
| 2019 | 3 | 1 |
| 2020 | 4 | 4 |
| 2021 | 2 | 3 |
| 2022 | 1 | 3 |
| 2023 | 1 | 3 |
| 2024 | 3 | 5 |
| 2025 | 2 | 1 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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- Batch soldering of different elements in power module19 Aug 2025US 12,394,769 B2Infineon Technologies AG
- Card-type medium and card-type medium manufacturing method25 Mar 2025US 12,260,278 B2Toppan Inc.
- Electronic component module, and method of manufacturing electronic component module24 Dec 2024US 12,177,990 B2Murata Manufacturing Co., Ltd.
- Method and system for stacking printed circuit board9 Jul 2024US 12,035,474 B2Chiun Mai Communication Systems, Inc.
- Electrical circuit forming method and electrical circuit forming device20 Aug 2026US 2026/0247540 A1Fuji Corporation
- Electronic package and method for forming the same28 May 2026US 2026/0150199 A1JCET STATS ChipPAC Korea Limited
- Low temperature solder interconnect for package pitch scaling3 Jul 2025US 2025/0218998 A1Intel Corporation
- Materials for semiconductor package mount applications and methods of using the same21 Nov 2024US 2024/0389240 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Modular routable circuit board conductor blocks14 Nov 2024US 2024/0381541 A1Microsoft Technology Licensing, LLC
Most cited
By later US patents
- Thin stacked integrated circuit device208US 6,137,164 ATexas Instruments Incorporated · 2000
- Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor127US 6,952,049 B1Ngk Spark Plug Co., Ltd. · 2005
- Composite connection structure and method of manufacturing90US 6,337,445 B12002
- High density column grid array connections and method thereof26US 6,429,388 B1International Business Machines Corporation · 2002
- Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor26US 7,239,014 B2Ngk Spark Plug Co., Ltd. · 2007