High density column grid array connections and method thereof
AssigneeInternational Business Machines Corporation
InventorsMario J. Interrante, Brenda Peterson, Sudipta K. Ray, William E. Sablinski, Amit K. Sarkhel
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Abstract
The present invention relates generally to a new semiconductor chip carrier connections, where the chip carrier and the second level assembly are made by a surface mount technology. More particularly, the invention encompasses surface mount technologies, such as, Ball Grid Array (BGA), Column Grid Array (CGA), to name a few, where the surface mount technology comprises essentially of a non-solder metallic connection, such as, a copper connection. The present invention is also related to Column Grid Array structures and process thereof.
Claims14
A metallic electrical interconnect structure for connecting a first pad on a chip carrier substrate and a second pad on an organic board, comprising:
- an electrically conductive column having a first end and a second end, said column being of a non-solder metallic material, the first end being connected to the first pad on the chip carrier substrate and the second end being connected to the second pad on the organic board;
- a first solder material connecting the first end of the column to the first pad on the chip carrier substrate;
- and
- a second solder material connecting the second end of the column to the second pad on the organic board;
- wherein said first solder material has a first melting temperature, and said second solder material has a second melting temperature less than the first melting temperature.
Dependencies are inferred from the claim text.