Card-type medium and card-type medium manufacturing method

A card-type medium, comprising:

• a card body;
• an exposed component that is accommodated inside an opening formed in a front surface of the card body and is disposed so as to be partially exposed on the front surface;
• and
• a circuit board that is embedded in the card body and to which the exposed component is attached, wherein
• the exposed component includes a first exposed component that is attached to the circuit board with an intermediate spacer interposed therebetween,
• the first exposed component and the intermediate spacer are joined together by a first conductive joining material,
• each of the first exposed component and the intermediate spacer comprises glass epoxy;
• the circuit board and the intermediate spacer are joined together by a second conductive joining material, and,
• a difference between a joint-forming temperature of the first conductive joining material and a joint-forming temperature of the second conductive joining material is 20° C. or higher.