Electronic package and method for forming the same

A method for forming an electronic package, comprising:

• providing a substrate, wherein the substrate comprises a first conductive pad where a terminal of a first electronic component is to be mounted and a second conductive pad where a terminal of a second electronic component is to be mounted, wherein the first conductive pad is adjacent to the second conductive pad;
• forming a first solder paste on the first conductive pad;
• reflowing the first solder paste on the first conductive pad to form a first solder layer;
• forming a second solder paste on the first solder layer and on the second conductive pad, respectively;
• placing the first electronic component and the second electronic component on the substrate such that the terminal of the first electronic component is in contact with the second solder paste on the first solder layer, and the terminal of the second electronic component is in contact with the second solder paste on the second conductive pad;
• and
• reflowing the second solder paste to mount the first electronic component and the second electronic component onto the substrate.