Batch soldering of different elements in power module

An electronic device, comprising:

• a substrate comprising first and second metal regions;
• a first passive device that comprises a metal joining surface and is arranged on the substrate with the metal joining surface of the first passive device facing first metal region;
• a semiconductor die that comprises a metal joining surface and is arranged on the substrate with the metal joining surface of the semiconductor die facing the second metal region;
• a first soldered joint between the metal joining surface of the first passive device and the first metal region;
• and
• a second soldered joint between the metal joining surface of the semiconductor die and the second metal region,
• wherein a minimum thickness of the first soldered joint is greater than a maximum thickness of the second soldered joint, and
• wherein the first passive device is attached to the substrate solely by the first soldered joint,
• wherein the minimum thickness of the first soldered joint is equal to or greater than 30 μm, and wherein the maximum thickness of the second soldered joint is equal to or less than 10 μm.

An electronic device, comprising:

• a substrate comprising first and second metal regions that are separate parts of a continuous structure;
• a first passive device that comprises a metal joining surface and is arranged on the substrate with the metal joining surface of the first passive device facing first metal region;
• a semiconductor die that comprises a metal joining surface and is arranged on the substrate with the metal joining surface of the semiconductor die facing the second metal region;
• a first soldered joint between the metal joining surface of the first passive device and the first metal region;
• and
• a second soldered joint between the metal joining surface of the semiconductor die and the second metal region,
• wherein a minimum thickness of the first soldered joint is greater than a maximum thickness of the second soldered joint.