Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor
AssigneeNgk Spark Plug Co., Ltd.
InventorsKouki Ogawa, Eiji Kodera
Life of this patent
Estimating the term…
Loading patent…
AssigneeNgk Spark Plug Co., Ltd.
InventorsKouki Ogawa, Eiji Kodera
Estimating the term…
A capacitor-built-in-type printed wiring substrate which can reliably eliminate noise and attain extremely low resistance and low inductance in connections between an IC chip and the capacitor, and a printed wiring substrate and capacitor for use in the same. A capacitor-built-in-type printed wiring substrate 100 on which an IC chip is mounted includes a capacitor-built-in-type printed wiring substrate 110 and an IC chip 101 mounted on the capacitor-built-in-type printed wiring substrate 110. A printed wiring substrate 120 includes a number of connection-to-IC substrate bumps 152 and a closed-bottomed capacitor accommodation cavity 121 formed therein. A capacitor 130 is disposed in the cavity 121 and includes a pair of electrode groups 133E and 133F and a number of connection-to-IC capacitor bumps 131 connected to either one of the paired electrode groups 133E and 133F. The connection-to-IC capacitor bumps 131 are flip-chip-bonded to corresponding connection-to-capacitor bumps 103 on the IC chip 101. The connection-to-IC substrate bumps 152 are flip-chip-bonded to corresponding connection-to-substrate bumps 104 on the IC chip 101.
A capacitor-built-in-type printed wiring substrate for mounting an IC chip or IC-chip-carrying printed wiring substrate, comprising:
A capacitor to be attached to a printed wiring substrate so as to form a capacitor-built-in type printed wiring substrate, and to be connected, when so attached, to an IC chip or IC-chip-carrying printed wiring substrate, the capacitor comprising:
Dependencies are inferred from the claim text.