Electrical circuit forming method and electrical circuit forming device

An electrical circuit forming device comprising:

• a wiring forming device configured to form a metal wiring line;
• an application device configured to apply a conductive fluid;
• a curing device configured to cure the conductive fluid;
• a mounting device configured to mount an electronic component;
• and
• a control device,
• wherein the control device is configured to execute:
• a wiring forming process of forming the metal wiring line on a resin layer using the wiring forming device;
• a first application process of applying the conductive fluid onto a planned mounting position of an electrode of an electronic component on the metal wiring line using the application device;
• a first curing process of curing the conductive fluid applied in the first application process using the curing device;
• a second application process of applying a conductive fluid onto the conductive fluid cured in the first curing process using the application device;
• a mounting process of mounting the electronic component such that the electrode comes into contact with the conductive fluid applied in the second application process using the mounting device;
• and
• a second curing process of curing the conductive fluid applied in the second application process using the curing device after the electronic component is mounted in the mounting process.