Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor

A printed wiring substrate having a planar surface and a built-in capacitor having vertical sides on which an IC-chip-carrying printed wiring substrate is mounted, said printed wiring substrate comprising a capacitor accommodation cavity selected from the group consisting of a closed-bottom cavity and a through hole cavity extending in the thickness direction of the printed wiring substrate and a capacitor disposed in said cavity, wherein the vertical sides of the capacitor and the printed wiring substrate are fixed together with an insulating resin filling a gap between the cavity and the capacitor, characterized in that:

• the capacitor comprises:
• a pair of electrodes or electrode groups;
• and
• the capacitor comprises a plurality of capacitor terminals, wherein the respective capacitor terminals are electrically connected to one or the other of the paired electrodes or electrode groups;
• the printed wiring substrate comprises a plurality of substrate terminals;
• the IC chip-carrying printed wiring circuit comprises a plurality of connection-to-capacitor terminals and a plurality of connection-to-substrate terminals;
• the plurality of capacitor terminals of the capacitor are respectively bonded in a connection-face-to-connection-face manner directly to a plurality of connection-to-capacitor terminals of the IC-chip-carrying printed wiring substrate;
• and
• the plurality of substrate terminals of the printed wiring substrate are respectively bonded in a connection-face-to-connection-face manner to a plurality of connection-to-substrate terminals of the IC-chip-carrying printed wiring substrate.

A printed wiring substrate having a planar surface and a built-in capacitor having vertical sides for mounting an IC chip or IC-chip-carrying printed wiring substrate having a plurality of connection-to-capacitor terminals and a plurality of connection-to-substrate terminals, said printed wiring substrate comprising a capacitor accommodation cavity selected from the group consisting of a closed-bottom cavity and a through hole cavity extending in the thickness direction of the printed wiring substrate and a capacitor disposed in said cavity, wherein the vertical sides of the capacitor and the printed wiring substrate are fixed together with an insulating resin filling a gap between the cavity and the capacitor, characterized in that:

• the capacitor comprises:
• a pair of electrodes or electrode groups;
• and
• the capacitor comprises a plurality of capacitor terminals capable of being respectively flip-chip-bonded or bonded in a connection-face-to-connection-face manner to a plurality of connection-to-capacitor terminals of the IC chip or IC-chip-carrying printed wiring substrate, wherein the respective capacitor terminals are electrically connected to one or the other of the paired electrodes or electrode group;
• and
• the printed wiring substrate comprises a plurality of substrate terminals capable of being respectively flip-chip-bonded or bonded in a connection-face-to-connection-face manner directly to a plurality of connection-to-substrate terminals of the IC chip or IC-chip-carrying printed wiring substrate.