Method and system for stacking printed circuit board

A system for stacking printed circuit boards comprising:

• a solder paste printer configured to print a solder paste, the solder paste comprising a first solder paste and a second solder paste;
• a pick and place machine configured to place components;
• and
• a reflow soldering machine configured to perform reflow soldering;
• wherein the solder paste printer is further configured to print the first solder paste on a lower baseboard, the pick and place machine is further configured to place a placement component and a pinboard on the lower baseboard, the reflow soldering machine is further configured to reflow solder the lower baseboard with the placement component and the pinboard, to connect the placement component and the pinboard to the lower baseboard through the first solder paste, and thereby forming a first assembly;
• wherein the solder paste printer is further configured to print the second solder paste on a upper baseboard, the pick and place machine is further configured to place the placement component and the first assembly on the upper baseboard, the reflow soldering machine is further configured to reflow solder the upper baseboard with the placement component and the first assembly, to connect the placement component to the upper baseboard through the first solder paste, and to connect the first assembly to the upper baseboard through the second solder paste, and thereby forming a printed circuit board;
• and
• wherein a melting point of the first solder paste is higher than a melting point of the second solder paste.