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US 12,177,990 B2Granted
Electronic component module, and method of manufacturing electronic component module
AssigneeMurata Manufacturing Co., Ltd.
InventorTakahiro Kitazume
Life of this patent
Estimating the term…
Abstract
An electronic component module includes a substrate including a first main surface and a second main surface, and using a side near the second main surface as a mounting side, an external terminal by a solder ball made of first solder, on the second main surface, and a first electronic component mounted by using second solder, on the first main surface, and a melting point of the first solder is higher than a melting point of the second solder.
Claims10
An electronic component module comprising:
- a substrate including a first main surface and a second main surface, the second main surface being a mounting side;
- an external terminal provided by a solder ball comprising a first solder, on the second main surface;
- a first electronic component mounted by using a second solder, on the first main surface, wherein a melting point of the first solder is higher than a melting point of the second solder;
- and
- a second electronic component mounted by using the first solder, on the second main surface.
2 more elements
Dependencies are inferred from the claim text.