H05K 2203/0455
Pth for surface mount device [smd]
Official title: PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
H05K2203/0455 (Pth for surface mount device [smd]) appears on 159 US grants and 102 published applications in this corpus.
Search patents in H05K- Granted patents
- 159
- Published applications
- 102
- Assignees
- 93
- Inventors
- 345
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 2 | 0 |
| 1990 | 3 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 5 | 0 |
| 1994 | 3 | 0 |
| 1995 | 3 | 0 |
| 1996 | 6 | 0 |
| 1997 | 7 | 0 |
| 1998 | 9 | 0 |
| 1999 | 7 | 0 |
| 2000 | 7 | 0 |
| 2001 | 14 | 8 |
| 2002 | 9 | 10 |
| 2003 | 14 | 11 |
| 2004 | 8 | 7 |
| 2005 | 3 | 3 |
| 2006 | 4 | 7 |
| 2007 | 4 | 9 |
| 2008 | 4 | 9 |
| 2009 | 4 | 9 |
| 2010 | 8 | 5 |
| 2011 | 3 | 6 |
| 2012 | 5 | 0 |
| 2013 | 1 | 1 |
| 2014 | 0 | 1 |
| 2015 | 0 | 1 |
| 2016 | 1 | 2 |
| 2017 | 1 | 4 |
| 2018 | 1 | 1 |
| 2019 | 2 | 0 |
| 2020 | 1 | 3 |
| 2021 | 3 | 2 |
| 2022 | 0 | 0 |
| 2023 | 1 | 2 |
| 2024 | 1 | 1 |
| 2025 | 1 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module14 Apr 2026US 12,604,391 B2Vitesco Technologies GmbH
- Connection method for chip and circuit board, and circuit board assembly and electronic device18 Feb 2025US 12,232,266 B2Intellimicro Medical Co., Ltd.
- Method of forming a top plane connection in an electro-optic device16 Jul 2024US 12,038,666 B2E Ink Corporation
- Semiconductor device manufacturing method9 May 2023US 11,647,593 B2Sony Interactive Entertainment Inc.
- Method for producing a printed circuit board having thermal through-contacts7 Sep 2021US 11,116,071 B2ZKW Group GmbH
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module1 Aug 2024US 2024/0260168 A1Vitesco Technologies GmbH
- 3d printed attachment devices for electronics17 Aug 2023US 2023/0262886 A1
- Connection method for chip and circuit board, and circuit board assembly and electronic device16 Mar 2023US 2023/0081618 A1Intellimicro Medical Co., Ltd.
- Semiconductor device manufacturing method and screen4 Nov 2021US 2021/0345496 A1Sony Interactive Entertainment Inc.
- Method of forming a top plane connection in an electro-optic device12 Aug 2021US 2021/0247657 A1E Ink Corporation
Most cited
By later US patents
- Passive interposer including at least one passive electronic component225US 5,530,288 AInternational Business Machines Corporation · 1996
- Alignment-enhancing feed-through conductors for stackable silicon-on-sapphire wafers209US 4,394,712 AGeneral Electric Company · 1983
- Method for interconnecting a flip chip to a printed circuit substrate194US 5,615,477 ASheldahl, Inc. · 1997
- Solder ball connect pad-on-via assembly process181US 5,275,330 AInternational Business Machines Corporation · 1994
- Multi-connection via with electrically isolated segments154US 6,388,208 B1Teradyne, Inc. · 2002