Semiconductor device manufacturing method and screen
AssigneeSony Interactive Entertainment Inc.
InventorsKazuki Sasao, Katsushi Wada
Life of this patent
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Abstract
A printed circuit board has an in-pad via. In a first step, a component is mounted on a first surface of a printed circuit board. A screen to be used in a second step has openings at positions corresponding to those of a plurality of pads on a second surface and has a recess positioned to overlap an in-pad via. Solder cream is applied from above the screen, and the screen is removed. Then, a component is mounted on the second surface.
Claims4
A manufacturing method of a semiconductor device, the manufacturing method comprising:
- a first step of mounting a first component group on a first surface of a printed circuit board;
- and
- a second step of mounting a second component group on a second surface of the printed circuit board, wherein
- the printed circuit board has an in-pad via,
- the first step includes
- applying solder cream to a plurality of pads on the first surface,
- mounting the first component group on the first surface, and
- heating and cooling the printed circuit board, and
- the second step includes
- placing, on the second surface, a screen (metal mask) having openings at positions of a plurality of pads on the second surface and having a recess positioned to overlap the in-pad via,
- applying solder cream from above the screen and removing the screen,
- mounting the second component group on the second surface, and
- heating and cooling the printed circuit board.
A screen that is used when components are to be mounted on a printed circuit board having an in-pad via, the screen comprising:
- a plurality of openings that are disposed at positions corresponding to positions of a plurality of pads formed on the printed circuit board;
- and
- a recess that is positioned to overlap the in-pad via.
A manufacturing method of a semiconductor device having a voltage stabilization module, the manufacturing method comprising:
- a first step of mounting a first component group including at least one power transistor on a first surface of a printed circuit board;
- and
- a second step of mounting a second component group including at least one inductor on a second surface of the printed circuit board, wherein
- the printed circuit board has an in-pad via that is positioned to overlap a back-surface electrode of the power transistor,
- the first step includes
- applying solder cream to a plurality of pads on the first surface,
- mounting the first component group on the first surface, and
- heating and cooling the printed circuit board, and
- the second step includes
- placing, on the second surface, a screen having openings at positions of a plurality of pads on the second surface and having a recess positioned to overlap the in-pad via,
- applying solder cream from above the screen and removing the screen,
- mounting the second component group on the second surface, and
- heating and cooling the printed circuit board.
Dependencies are inferred from the claim text.