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US 12,038,666 B2Granted
Method of forming a top plane connection in an electro-optic device
AssigneeE Ink Corporation
InventorsMatthew Joseph Kayal, Steven Joseph Battista, Richard J. Paolini, Jr., Shyamala A. Subramanian
Life of this patent
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Abstract
An electrical connection between the backplane and the light-transmissive front electrode of an electrowetting device is provided by forming an aperture through the top front electrode coupled and a substrate coupled thereto and subsequently introducing a flowable, electrically-conductive material into the aperture. The flowable, electrically-conductive material provides an electrical contact between the light-transmissive electrically-conductive layer and the backplane.
Claims5
An electro-wetting device comprising:
- a light-transmissive electrically-conductive layer coupled to a top light-transmissive substrate;
- a backplane comprising an array of pixel electrodes, and an arrangement of conductors to connect the pixel electrodes to drive circuitry for controlling the electro-wetting device;
- a hydrophobic dielectric layer adjacent the array of pixel electrodes;
- an aperture through the light-transmissive electrically-conductive layer and the top light-transmissive substrate;
- and
- a flowable, electrically-conductive material disposed in the aperture, the flowable, electrically-conductive material being in electrical contact with the light-transmissive electrically-conductive layer, extending through the top light-transmissive substrate, and making an electrical connection between the light-transmissive electrically-conductive layer and an electrode of the backplane.
3 more elements
Dependencies are inferred from the claim text.