Back to results
US 6,388,208 B1Granted
Multi-connection via with electrically isolated segments
AssigneeTeradyne, Inc.
InventorsSepehr Kiani, Mikhail Khusid
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeTeradyne, Inc.
InventorsSepehr Kiani, Mikhail Khusid
Estimating the term…
An interconnection circuit and related techniques are described. The interconnection circuit includes a plated through hole having a plurality of electrically isolated segments with at least one of the plurality of electrically isolated segments coupled to a signal path and at least one of the electrically isolated segments coupled to ground. With this arrangement, the circuit provides a signal path between a first and a second different layers of a multilayer. By providing one segment as a signal segment and another segment as a ground segment the size and shape of the electrically isolated segments can be selected to provide the interconnection circuit having a predetermined impedance characteristic. The interconnection circuit can thus be impedance matched to circuit board circuits, devices and transmission lines, such as striplines, microstrips and co-planar waveguides. This results in an interconnection circuit which maintains the integrity of relatively high-frequency signals propagating through the interconnection circuit from the first layer to the second layer. The interconnect circuits can be formed by creating distinct conductor paths within the cylindrical plated through-holes using variety of manufacturing techniques including, but not limited to, broaching techniques, electrostatic discharge milling (EDM) techniques and laser etching techniques.
An interconnection structure for providing a signal path between a first layer and a second different layer of a multi-layer structure, the interconnection structure comprising a plated through hole having a plurality of electrically isolated segments with at least one of the plurality of electrically isolated segments coupled to one of a signal path and a circuit component and at least one of the electrically isolated segments coupled to a ground plane layer of the multi-layer structure.
A interconnection structure for providing a signal path between a first signal trace on a first layer of a multi-layer structure and a second signal trace on a second different layer of the multilayer structure, the interconnection structure comprising:
A multi-connection via provided in a printed circuit board having a plurality of signal layers and a plurality of ground layers, the multi-connection via comprising a plated through hole provided in the printed circuit board, said plated through hole having a first plurality of separate electrically isolated segments, with at least one of the first plurality of electrically isolated segments adapted to coupled to one of a signal path and a circuit component and at least one of the first plurality of electrically isolated segments adapted to couple to at least one of the plurality of ground plane layers of the printed circuit board, wherein the widths of each of the at least one of the plurality of electrically isolated segments adapted to coupled to one of a signal path and a circuit component and the at least one of the electrically isolated segments adapted to couple to at least one of the plurality of ground plane layers of the printed circuit board are selected to provide the multi-connection via having a predetermined impedance characteristic.
A interconnection device for providing a signal path between a first layer and a second different layer of a multilayer structure, the interconnection device comprising a plated through hole having a first continuous nonconductive region provided therein to define a first region of the plated through hole corresponding to a via trace segment and a second region of the plated through hole corresponding to a ground trace segment wherein said via trace segment is electrically isolated from the ground trace segment and is adapted to couple to a signal path.
An interconnection structure for providing a signal path between a first layer and a second different layer of a multi-layer structure which includes a plurality of signal layers and a plurality of ground layers, the interconnection structure comprising:
Dependencies are inferred from the claim text.