H05K 2203/0445
Removing excess solder on pads
Official title: Removing excess solder on pads; removing solder bridges, e.g. for repairing or reworking
H05K2203/0445 (Removing excess solder on pads) appears on 24 US grants and 25 published applications in this corpus.
Search patents in H05K- Granted patents
- 24
- Published applications
- 25
- Assignees
- 23
- Inventors
- 72
- Latest grant
- 26 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 1 | 2 |
| 2016 | 1 | 6 |
| 2017 | 4 | 4 |
| 2018 | 3 | 4 |
| 2019 | 2 | 0 |
| 2020 | 2 | 0 |
| 2021 | 0 | 1 |
| 2022 | 1 | 1 |
| 2023 | 0 | 1 |
| 2024 | 1 | 4 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for producing electronic component mounted substrate26 Aug 2025US 12,402,255 B2Panasonic Intellectual Property Management Co., Ltd.
- Solder recovery device9 Apr 2024US 11,956,902 B2Fuji Corporation
- Driving circuit for display panel and display device16 Aug 2022US 11,417,255 B2Hkc Corporation Limited
- Accurate positioning and alignment of a component during processes such as reflow soldering26 May 2020US 10,667,387 B2ams Sensors Singapore Pte. Ltd.
- Solder paste misprint cleaning3 Mar 2020US 10,576,566 B2International Business Machines Corporation
- Redressing a chip site on a multi-chip laminate package12 Jun 2025US 2025/0191937 A1International Business Machines Corporation
- Configurable warpage control spacers17 Oct 2024US 2024/0347432 A1Nokia Solutions and Networks Oy
- Power module and vehicle-mounted power circuit19 Sep 2024US 2024/0312895 A1
- Method for producing electronic component mounted substrate8 Aug 2024US 2024/0268036 A1Panasonic Intellectual Property Management Co., Ltd.
- Connecting arrangement9 May 2024US 2024/0155766 A1Robert Bosch GmbH
Most cited
By later US patents
- Method for removing excess solder from printed circuit boards18US 4,769,083 AGould Inc. · 1988
- Process for reworking circuit boards13US 6,349,871 B1International Business Machines Corporation · 2002
- Apparatus for producing an electronic circuit11US 6,062,460 ASharp Kabushiki Kaisha · 2000
- Method for removing solder from the drill holes of empty printed circuit boards coated with solder7US 4,501,770 ASiemens Aktiengesellschaft Berlin & Munchen · 1985
- Machine and process for reworking circuit boards6US 6,216,938 B1International Business Machines Corporation · 2001