Method for removing excess solder from printed circuit boards
AssigneeGould Inc.
InventorLeonard A. Tiritilli
Life of this patent
Estimating the term…
Abstract
A method for removing excess solder from a printed circuit board is practiced by mixing a quantity of ceramic beads with an oil to form a fluidized bed mixture. The fluidized bed mixture is heated to a temperature above the melting point of a solder on the printed circuit board. A surface of the printed circuit board to be cleaned is placed in contact with the heated fluidized bed and agitated against the bed to remove excess solder.
Claims13
A method for removing excess solder from a previously soldered printed circuit board, comprising the steps of:
- heating a mixture of a fluid and a plurality of beads to a temperature of about 525.degree. F.;
- contacting a surface of a previously soldered printed circuit board having excess solder thereon with said mixture to effect softening of a portion said excess solder;
- and moving said mixture with respect to said printed circuit board to effect flow of said mixture past said surface and to effect collisions of said particles with said surface to remove excess solder therefrom.
A method for removing excess solder from a previously soldered printed circuit board, comprising the steps of:
- heating a mixture of a fluid and a plurality of ceramic beads to a temperature of about 525.degree. F.;
- contacting a surface of a previously soldered printed circuit board having excess solder thereon, with said mixture to effect softening of a portion of said excess solder;
- and moving said mixture with respect to said printed circuit board to effect flow of said mixture past said surface and to effect collisions of said ceramic beads with said surface to remove excess solder therefrom.
A method for removing excess solder from a previously soldered printed circuit board, comprising the steps of:
- heating a mixture of fusing oil and glass beads to a temperature above 500.degree. F.;
- introducing a previously soldered printed circuit board having a pair of surfaces into contact with said heated mixture of fusing oil and glass beads so that one of said surfaces is in contact with said heated mixture of fusing oil and glass beads while the other of said surfaces is exposed to air, and agitating said heated mixture of fusing oil and glass beads against said immersed surface of said printed circuit board to remove excess solder therefrom.
A method for removing excess solder from a previously soldered printed circuit board, comprising the steps of:
- heating a fluid and a plurality of bristles to a temperature of about 525.degree. F.;
- contacting a surface of a previously soldered printed circuit board having excess solder thereon with said fluid and said plurality of bristles to effect softening of a portion of said solder;
- and moving said printed circuit board with respect to said fluid and said plurality of bristles to effect moving contact of said plurality of bristles with said surface to remove excess solder therefrom.
A method for removing excess solder from a previously soldered printed circuit board, comprising the steps of:
- heating oil and a plurality of bristles to a temperature of about 525.degree. F.;
- contacting a surface of a previously soldered printed circuit board having excess solder thereon with said heated oil and said plurality of bristles to effect softening of a portion of said solder;
- and moving said printed circuit board with respect to said heated oil and said plurality of bristles to effect moving contact of said plurality of bristles with said surface to remove excess solder therefrom.
A method for removing excess solder from a previously soldered printed circuit board, comprising the steps of:
- heating a plurality of bristles immersed in fusing oil to a temperature above 500.degree. F.;
- introducing a previously soldered printed circuit board having a pair of surfaces into contact with said heated fusing oil so that one of said surfaces is in contact with said plurality of bristles and heated fusing oil while the other of said surfaces is exposed to air;
- agitating said plurality of bristles and heated fusing oil against said immersed surface of said printed circuit board to remove excess solder from said printed circuit board.
Dependencies are inferred from the claim text.