Apparatus for producing an electronic circuit

An apparatus for producing an electronic circuit device by aligning projecting electrodes made of brazing metal and formed on one principal plane of a semiconductor device with a substrate for mounting a semiconductor device having lands for connection corresponding to the projecting electrodes, and melting the projecting electrodes by heating, thereby mounting the semiconductor device on the substrate, wherein, in a case where the semiconductor device once mounted is defective, the defective semiconductor device is removed from the substrate and a new semiconductor device is mounted on the substrate,

• the apparatus comprising:
• a holder holding the substrate;
• a holder holding the defective semiconductor device or the new semiconductor device;
• an alignment unit aligning the substrate with the defective semiconductor device or the new semiconductor device;
• a unit removing an excessive residue of a brazing metal residue remaining on connecting portions of the substrate from which the defective semiconductor device has been removed and leaving a uniform amount of the brazing metal residue corresponding to surface tension of the brazing metal residue on the connecting portions;
• and
• a heating unit melting the projecting electrodes of the aligned new semiconductor device by heating, thereby connecting the new semiconductor device to the substrate.

An apparatus for producing an electronic circuit device by aligning projecting electrodes made of brazing metal and formed on one principal plane of a semiconductor device with a substrate for mounting a semiconductor device having lands for connection corresponding to the projecting electrodes, and melting the projecting electrodes by heating, thereby mounting the semiconductor device on the substrate, wherein, in a case where the semiconductor device once mounted is defective, the defective semiconductor device is removed from the substrate and a new semiconductor device is mounted on the substrate,

• the apparatus comprising:
• a holder holding the substrate;
• a holder holding the defective semiconductor device or the new semiconductor device;
• an alignment unit aligning the substrate with the defective semiconductor device or the new semiconductor device;
• a unit removing an excessive residue of a brazing metal residue remaining on connecting portions of the substrate from which the defective semiconductor device has been removed and leaving a uniform amount of the brazing metal residue corresponding to surface tension of the brazing metal residue on the connecting portions;
• a jig for transferring brazing metal paste to tip ends of the projecting electrodes of the new semiconductor device, a groove in a shape of an expanding slot or a circular concave groove being formed in a center portion of the jig, and a depth of the groove being prescribed to be about 1/3 to about 1/2 of a height of the projecting electrodes of the semiconductor device;
• and
• a heating unit melting the projecting electrodes of the aligned new semiconductor device by heating, thereby connecting the new semiconductor device to the substrate.