Machine and process for reworking circuit boards

An apparatus for reworking a defective printed circuit board (PCB) having solder-plugged plated through holes (PTHs), comprising:

• movable supporting means for carrying said defective PCB containing solder-plugged plated through holes to be reworked, said movable supporting means being movable to center a defective area of said PCB below an air supplying means;
• air supplying means disposed above said defective PCB to supply air under pressure to said solder-plugged plated through holes of said defective area of said PCB to remove excess solder from said solder-plugged plated through holes of said defective area, and to cool said PCB;
• heat protective means surrounding said defective area of said PCB to prevent solder splashing upon, and damage to, non-defective areas of said PCB;
• heating means disposed below said solder-plugged plated through holes of said defective area of said PCB for locally heating said defective area to cause the solder in said solder-plugged plated through holes to melt;
• and
• control means operatively connected to said heating means and to said means for supplying air, said control means operatively controlling said heating means and said means for supplying air in a proper operational sequence, so that said heating means is removed during an excess solder removing and cooling cycle.