Configurable warpage control spacers
AssigneeNokia Solutions and Networks Oy
InventorsAlex Chan, Paul Brown, Daniel Fazari
Life of this patent
Estimating the term…
Abstract
A circuit assembly, including: an integrated circuit (IC) with a plurality of connection pads; a ball grid array (BGA) including a plurality of solder balls arranged in an array, where plurality of solder balls are configured to connect the plurality of connections pads to a plurality of connections pads on a PCB; and a BGA spacer configured to fit among the plurality of solder balls, wherein the BGA spacer has a width based upon a height and spacing of the plurality of solder balls and a height based upon a height and spacing of the plurality of solder balls and a minimum distance between the IC and the PCB to prevent shorting of adjacent solder balls.
Claims16
A circuit assembly, comprising:
- an integrated circuit (IC) with a plurality of connection pads;
- a ball grid array (BGA) including a plurality of solder balls arranged in an array, wherein the plurality of solder balls are configured to connect the plurality of connections pads to a plurality of connections pads on a PCB;
- and
- a BGA spacer configured to fit among the plurality of solder balls, wherein the BGA spacer has a width based upon a height and spacing of the plurality of solder balls and a height based upon a height and spacing of the plurality of solder balls and a minimum distance between the IC and the PCB to prevent shorting of adjacent solder balls.
A method of assembling a circuit assembly, comprising:
- characterizing warpage characteristics of an integrated circuit (IC) with a plurality of connect
- ion pads;
- determining a location of a ball grid array (BGA) spacer among a plurality of solder balls that are part of a BGA attached to the IC based upon the warpage characteristics of the IC;
- determining a shape and dimensions of the BGA spacer based upon a height and spacing of the plurality of solder balls, wherein the height of the BGA spacer is further based upon a minimum distance between the IC and a PCB to prevent shorting of adjacent solder balls;
- producing the BGA spacer;
- placing the BGA spacer on the BGA among the plurality of solder balls;
- placing BGA and IC on the PCB wherein the PCB has a plurality of connection pads corresponding to the plurality of solder balls;
- and
- performing solder processing of the IC, BGA, and PCB.
A method of assembling a circuit assembly, comprising:
- characterizing warpage characteristics of an integrated circuit (IC) with a plurality of connection pads;
- determining locations of a plurality of ball grid array (BGA) spacers among a plurality of solder balls that are part of a BGA attached to the IC based upon the warpage characteristics of the IC;
- determining a shape and dimensions of the plurality of BGA spacers based upon a height and spacing of the plurality of solder balls, wherein a height of the plurality of BGA spacers is further based upon a minimum distance between the IC and a PCB to prevent shorting of adjacent solder balls;
- producing the plurality of BGA spacers;
- placing the plurality of BGA spacers on the BGA among the plurality of solder balls;
- placing the BGA and IC on the PCB wherein the PCB has a plurality of connection pads corresponding to the plurality of solder balls;
- and
- perform solder processing of the IC, BGA, and PCB.
Dependencies are inferred from the claim text.