Redressing a chip site on a multi-chip laminate package

Abstract

A method and apparatus extracts solder from a redress site of multiple chips on a laminate structure. The method includes depositing conductive pads on a flexible insulating film with a same pitch as solder bumps on a laminate structure that are to be extracted. The flexible film is mounted on a retaining surface, and the conductive pads are heated at a temperature above a solder melting temperature. The retaining surface descends toward a laminate having solder thereon until the heated conductive pads come into contact with at least one solder bump. The retaining surface is retracted from contact and includes most of the at least one contacted solder bump that was on the laminate structure. The operations repeat until the solder remaining on die pads on the laminate is similar to an amount of initially arranged pre-solder.

Dependencies are inferred from the claim text.