H05K 2203/046
Means for drawing solder
Official title: Means for drawing solder, e.g. for removing excess solder from pads
H05K2203/046 (Means for drawing solder) appears on 66 US grants and 62 published applications in this corpus.
Search patents in H05K- Granted patents
- 66
- Published applications
- 62
- Assignees
- 57
- Inventors
- 175
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 3 | 1 |
| 2003 | 0 | 2 |
| 2004 | 0 | 2 |
| 2005 | 2 | 4 |
| 2006 | 1 | 2 |
| 2007 | 2 | 4 |
| 2008 | 3 | 1 |
| 2009 | 2 | 4 |
| 2010 | 2 | 6 |
| 2011 | 0 | 1 |
| 2012 | 4 | 3 |
| 2013 | 2 | 2 |
| 2014 | 2 | 5 |
| 2015 | 4 | 2 |
| 2016 | 2 | 4 |
| 2017 | 3 | 1 |
| 2018 | 2 | 6 |
| 2019 | 4 | 1 |
| 2020 | 2 | 1 |
| 2021 | 3 | 5 |
| 2022 | 2 | 0 |
| 2023 | 0 | 0 |
| 2024 | 1 | 5 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Connecting arrangement30 Jun 2026US 12,672,234 B2Robert Bosch GmbH
- Galvanic current protection for photoionization detector19 Nov 2024US 12,146,854 B2Mocon, Inc.
- Light device, headlight and method15 Nov 2022US 11,499,688 B2OSRAM GmbH
- Electronic device and electromagnetic shielding frame8 Mar 2022US 11,272,645 B2Wistron Neweb Corp.
- Preparation of solder bump for compatibility with printed electronics and enhanced via reliability14 Sep 2021US 11,122,692 B1Raytheon Company
- Power module and vehicle-mounted power circuit19 Sep 2024US 2024/0312895 A1
- Galvanic current protection for photoionization detector5 Sep 2024US 2024/0295528 A1Mocon, Inc.
- Reworking solder component without part removal11 Jul 2024US 2024/0237228 A9International Business Machines Corporation
- Connecting arrangement9 May 2024US 2024/0155766 A1Robert Bosch GmbH
- Reworking solder component without part removal25 Apr 2024US 2024/0138074 A1International Business Machines Corporation
Most cited
By later US patents
- Laser debridging of microelectronic solder joints28US 4,877,175 AGeneral Electric Company · 1989
- Printed wiring board having robber pads for excess solder19US 4,835,345 ACompaq Computer Corporation · 1989
- Solder draw pad18US 4,339,784 ARCA Corporation · 1982
- Anti-bridging pads for printed circuit boards and interconnecting substrates12US 5,679,929 ASolectron Corporqtion · 1997
- Printed circuit board and method for producing a printed circuit board11US 10,327,325 B2ZK W Group GmbH · 2019