Preparation of solder bump for compatibility with printed electronics and enhanced via reliability

A process of fabricating a printed circuit board, the process comprising:

• providing a first sheet of dielectric material including a first top surface having at least one first conductive trace and a second sheet of dielectric material including a second top surface having at least one second conductive trace;
• depositing a first solder bump on the at least one first conductive trace;
• applying the second sheet of dielectric material to the first sheet of dielectric material with bonding film sandwiched in between;
• bonding the first and second sheets of dielectric material to one another;
• providing a conductive material to connect the first solder bump on the at least one first conductive trace to the at least one second conductive trace;
• depositing a second solder bump on the at least one second conductive trace;
• and
• removing a portion of the second sheet of dielectric material between the first solder bump and the second solder bump to create a ramp between the first solder bump and the second solder bump,
• wherein the ramp is formed by milling along a continuous path through the first solder bump, the second sheet of dielectric material, the at least one second conductive trace, and the second solder bump.