Anti-bridging pads for printed circuit boards and interconnecting substrates
AssigneeSolectron Corporqtion
InventorsDouglas Wayne Greenfield, Richard Paul Yorkovich
Life of this patent
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Abstract
The present invention provides anti-bridging pad(s) for wave soldering of interconnecting substrates. In particular, the present invention provides interconnecting substrates (e.g. printed circuit board) having anti-bridging pad(s) which substantially conform to trailing pad(s), have geometries and/or placements with respect to trailing pad(s) in an array of functional pads which reduce or eliminate solder bridging.
Claims15
An interconnecting substrate suitable for wave soldering in a conveyor direction, the substrate including a leading edge and a trailing edge, comprising:
- an electrically insulating layer;
- an array of functional pads on the layer, wherein the array includes a trailing pad;
- and
- an anti-bridging pad spaced apart from the trailing pad and disposed between the trailing pad and the trailing edge of the substrate wherein at least one point on the edge of the anti-bridging pad is less than 0.03 inches from the closest point of the edge of trailing pad.
An interconnecting substrate suitable for wave soldering in a conveyor direction, the substrate including a leading edge and a trailing edge, comprising:
- an electrically insulating layer;
- an array of functional pads on the layer, wherein the array includes at least one row not on a 45.degree. angle with respect to the output direction and wherein the array includes a trailing pad;
- and
- an anti-bridging pad spaced apart from the trailing pad and disposed between the trailing pad and the trailing edge of the substrate, wherein an edge of the anti-bridging pad substantially corresponds to an edge of the trailing pad.
An interconnecting substrate suitable for wave soldering in a conveyor direction, the substrate including a leading edge and a trailing edge, comprising:
- an electrically insulating layer;
- an array of functional pads on the layer, wherein the array includes a trailing pad;
- and
- an anti-bridging pad disposed between the trailing pad and the trailing edge of the substrate, wherein the anti-bridging pad includes a serrated edge facing the trailing pad.
An interconnecting substrate suitable for wave soldering in a conveyor direction, the substrate including a leading edge and a trailing edge, comprising:
- an electrically insulating layer;
- an array of functional pads on the layer including a trailing pad;
- and
- an anti-bridging pad including a finger with a point which is closer to a line intersecting the substrate perpendicular to the conveyor direction and in front of the trailing pad than a point on the trailing pad.
Dependencies are inferred from the claim text.