Light device, headlight and method
AssigneeOSRAM GmbH
InventorMarkus Stange
Life of this patent
Estimating the term…
Abstract
A light device may include a printed circuit board having at least one conductive section. An LED may be electrically connected and fixed on a conductive section of the printed circuit board by means of a soldered connection. The printed circuit board may also include a coating-type insulating layer and/or the conductive section has an edge. The fixing region of the LED is connected to a discharge space by means of an outlet, so that during the production process, melted solder can flow off in a defined manner. The arrangement and/or embodiment of the outlet is such that in a preferred direction of movement of the LED is developed in order to position same in a defined manner.
Claims20
A light device having a printed circuit board, wherein the printed circuit board comprises:
- an electrically conductive substrate having a mounting area;
- at least one radiation source fastened to the mounting area via a soldered bond provided between the at least one radiation source and the mounting area, wherein the mounting area is fully delimited by a layer arranged on the substrate and/or by an edge of the electrically conductive substrate;
- wherein the at least one radiation source is fully arranged within the mounting area;
- at least one outlet space for a liquid solder;
- wherein the at least one outlet space is connected to the mounting area via at least one outlet opening, wherein the at least one outlet opening and/or the at least one outlet space is/are arranged and/or formed in such a way that during the production of the soldered bond, a defined positioning of the radiation source with respect to the layer and/or with respect to the edge takes place due to the flowing of the liquid solder through the at least one outlet opening in the at least one outlet space.
A method for producing a light device, wherein the method comprises:
- providing a printed circuit board, which comprises an electrically conductive substrate, which has a mounting area, wherein the mounting area is fully delimited by a layer arranged on the substrate and/or by an edge of the substrate, wherein at least one initially solder-free outlet space is formed for a liquid solder, which is provided during the production of a soldered bond between a radiation source and the mounting area wherein the at least one outlet space is connected to the mounting area via at least one outlet opening;
- applying a solder to the mounting area;
- arranging the radiation source on the solid or at least non-liquid solder on the mounting area;
- wherein the radiation source is fully arranged within the mounting area;
- heating and melting the solder, whereby a floating arrangement of the radiation source is achieved;
- flowing of the liquid solder via the at least one outlet opening into the at least one previously solder-free outlet space;
- wherein the radiation source is also moved with the flowing solder;
- stopping the movement of the radiation source by way of a border of the layer or an edge of the substrate and thus the radiation source reaches its final position.
Dependencies are inferred from the claim text.