Electronic device and electromagnetic shielding frame

An electronic device, comprising:

• an electromagnetic shielding frame including:
• a ring-shaped portion;
• and
• a plurality of soldering tabs extending from the ring-shaped portion along a protruding direction, wherein the soldering tabs are spaced apart from each other and are in a ring-shaped arrangement, wherein at least one of the soldering tabs has a patterned slot layout so as to be defined as a patterned tab, wherein the patterned tab includes a bottom side arranged away from the ring-shaped portion, and a portion of the patterned slot layout of the patterned tab arranged adjacent to the bottom side has a layout distance,
• wherein the patterned slot layout is arranged along a first direction and a second direction, and wherein the first direction and the protruding direction have a first angle therebetween that is smaller than 90 degrees, and the second direction and the protruding direction have a second angle therebetween that is smaller than 90 degrees;
• a circuit board having a first board surface and a second board surface that is opposite to the first board surface, wherein the circuit board includes a plurality of soldering pads arranged on the first board surface in a ring-shaped arrangement, and the soldering pads are spaced apart from each other and respectively correspond in position to the soldering tabs;
• an electronic component mounted on the first board surface of the circuit board, wherein the electronic component is arranged in an accommodating space surroundingly defined by the electromagnetic shielding frame and the circuit board;
• and
• a plurality of solders respectively disposed on the soldering pads, wherein the solders are connected to the soldering tabs, respectively, and wherein the patterned tab has an inner surface and an outer surface, and each of the inner surface and the outer surface of the patterned tab is formed with the patterned slot layout that does not penetrate through the patterned tab, so that the patterned tab is configured to allow the corresponding solder to climb thereon along the patterned slot layout in the first direction and the second direction so as to extend away from the bottom side.