H05K 2203/0415
Small preforms other than balls
Official title: Small preforms other than balls, e.g. discs, cylinders or pillars
H05K2203/0415 (Small preforms other than balls) appears on 260 US grants and 160 published applications in this corpus.
Search patents in H05K- Granted patents
- 260
- Published applications
- 160
- Assignees
- 141
- Inventors
- 542
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 9 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 4 | 0 |
| 1992 | 2 | 0 |
| 1993 | 7 | 0 |
| 1994 | 5 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 11 | 0 |
| 1998 | 9 | 0 |
| 1999 | 5 | 0 |
| 2000 | 11 | 0 |
| 2001 | 15 | 7 |
| 2002 | 11 | 8 |
| 2003 | 15 | 11 |
| 2004 | 12 | 11 |
| 2005 | 8 | 9 |
| 2006 | 4 | 9 |
| 2007 | 2 | 8 |
| 2008 | 5 | 5 |
| 2009 | 5 | 11 |
| 2010 | 7 | 13 |
| 2011 | 1 | 3 |
| 2012 | 7 | 2 |
| 2013 | 4 | 6 |
| 2014 | 1 | 3 |
| 2015 | 7 | 5 |
| 2016 | 5 | 3 |
| 2017 | 5 | 4 |
| 2018 | 5 | 4 |
| 2019 | 6 | 6 |
| 2020 | 6 | 6 |
| 2021 | 7 | 9 |
| 2022 | 3 | 3 |
| 2023 | 3 | 6 |
| 2024 | 2 | 4 |
| 2025 | 3 | 3 |
| 2026 | 8 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Printed circuit board, battery module, battery pack, and electrical device5 May 2026US 12,620,635 B2Contemporary Amperex Technology (Hong Kong) Limited
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module14 Apr 2026US 12,604,391 B2Vitesco Technologies GmbH
- Printed circuit board with a contact point7 Apr 2026US 12,597,750 B2KNORR-BREMSE Systeme fuer Nutzfahrzeuge GmbH
- Method of manufacturing multi-layer circuit board including extreme fine via and multi-layer circuit board manufactured by the same7 Apr 2026US 12,598,707 B2Tse Co., Ltd.
- Molded packages with through-mold interconnects17 Feb 2026US 12,557,221 B2NXP USA, Inc.
- Semiconductor package with a cavity substrate1 Jan 2026US 2026/0006726 A1UTAC Headquarters Pte. Ltd.
- Molded packages with through-mold interconnects22 May 2025US 2025/0168987 A1NXP USA, Inc.
- High-precision multilayer printed circuit board and 3d printing preparation method thereof30 Jan 2025US 2025/0040060 A1enovate3D (Hangzhou) Technology Development Co., Ltd.
- Methods, apparatuses, integrated circuits, and printed circuit boards for power conversion with reduced parasitics9 Jan 2025US 2025/0016911 A1Murata Manufacturing Co., Ltd.
- Electronic system assembly10 Oct 2024US 2024/0341041 A1Epirus, Inc.
Most cited
By later US patents
- Chip carrier mounting device187US 4,705,205 ARaychem Corporation · 1987
- Compliant interconnection and method therefor183US 4,642,889 AAMP Incorporated · 1987
- Flip chip adaptor package for bare die158US 6,265,766 B1Micron Technology, Inc. · 2001
- Chip mounting device154US 4,664,309 ARaychem Corporation · 1987
- Assembly aid for mounting packaged integrated circuit devices to printed circuit boards133US 6,084,781 AMicron Electronics, Inc. · 2000