US 12,557,221 B2Granted

Molded packages with through-mold interconnects

AssigneeNXP USA, Inc.

InventorsZhiwei Gong, Lakshminarayan Viswanathan, Li Li

Life of this patent

Estimating the term…

Loading patent…

Abstract

Molded device packages which allow electrical contacts to coupled to a first surface of a circuit substrate such as a printed circuit board while allowing the opposite surface to remain exposed for other purposes such as bonding thermal structures such as heatsinks include electrically-conductive pillars which are bonded to the first surface of the substrate and encapsulated in molding material. The molding material can one or more cavities over disposed over the first surface of the substrate which can be evacuated or gas-filled. The electrically-conductive pillars protrude from connected manifold and are joined to each other by a frame portion of the manifold. The manifold is patterned with a masking material that protects the pillars from being etched during a selective etching process which removes the frame portion of the manifold to separate the electrically-conductive pillars from each other.

Claims19

Dependent claims

A method of forming a device package, the method comprising:

providing an electrically conductive manifold that includes a frame structure that defines a plane and electrically conductive pillars that protrude from the frame structure in a direction perpendicular to the plane defined by the frame structure;
encapsulating the manifold in a volume of molding material and bonding the manifold to a first fir of a circuit substrate such that a surface of the manifold in the plane defined by the frame structure is an exposed surface disposed above the circuit substrate and surrounded by the volume of molding material;
and
selectively removing material of the frame structure to separate the electrically conductive pillars from each other;
wherein one or more of the electrically conductive pillars is electrically coupled to an electronic component disposed on the circuit substrate:
wherein the manifold is formed from a first metallic material;
wherein the method further comprises a masking material patterned on the exposed surface of the manifold;
and
wherein the method further comprises performing an etching process that preferentially removes the first metallic material compared to the masking material.

6 more elements

A method of forming a device package, the method comprising:

providing an electrically conductive manifold that includes a frame structure that defines a plane and electrically conductive pillars that protrude from the frame structure in a direction perpendicular to the plane defined by the frame structure;
encapsulating the manifold in a volume of molding material and bonding the manifold to a first surface of a circuit substrate such that a surface of the manifold in the plane defined by the frame structure is an exposed surface disposed above the circuit substrate and surrounded by the volume of molding material;
and
selectively removing material of the frame structure to separate the electrically conductive pillars from each other;
wherein the device package includes a cavity disposed between the volume of molding material and the first surface of the circuit substrate;
and
wherein one or more of the electrically conductive pillars are electrically coupled to electronic components disposed on the circuit substrate;
and
wherein the manifold is encapsulated prior to bonding the manifold to the first surface of the circuit substrate.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/518,377Filed 22 Nov 2023
Published: US 2025/0168987 A122 May 2025
Granted: 17 Feb 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification17 codes

H05K 1/185
Associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]: associated with components encapsulated…
H10W 40/228
Characterised by projecting parts, e.g. fins to increase surface area: the projecting parts being wire-shaped or pin-shaped
H05K 1/181
Structurally associated with non-printed electric components: associated with surface mounted components
H05K 3/0017
Working of insulating substrates or insulating layers: etching of the substrate by chemical or physical means