Flip chip adaptor package for bare die

A substrate having a plurality of circuits for connecting one or more bare semiconductor die to a second substrate, each bare semiconductor die of the one or more bare semiconductor die having a plurality of bond pads on a portion of a surface thereof and connected to said second substrate, said substrate using a plurality of bond wires to connect between the plurality of bond pads on said each bare semiconductor die of said one or more bare semiconductor die and said plurality of circuits on said substrate, comprising:

• a substrate having a first die side surface for attachment thereto of a portion of the surface having a plurality of bond pads of said one or more bare semiconductor die, a second attachment surface having a plurality of bond pads located thereon for the connection of said plurality of bond wires thereto, one or more vias extending therethrough for said plurality of bond wires to extend therethrough from said plurality of bond pads of said one or more bare semiconductor die, and a plurality of circuit traces for connection to said plurality of bond wires connected to said plurality of bond pads of said one or more bare semiconductor die and for electrically connecting between said one or more bare semiconductor die and said second substrate;
• and
• a plurality of electrical connectors located on the second attachment surface of the substrate for electrically connecting said substrate and said second substrate, the plurality of electrical connectors connected to the plurality of circuit traces.

A substrate having a plurality of circuits thereon for connecting a plurality of bare semiconductor die to a second substrate, each bare semiconductor of said plurality of bare semiconductor die having a plurality of bond pads on a portion of a surface thereof and connected to said second substrate, said substrate using a plurality of bond wires to connect between the plurality of bond pads on said plurality of bare semiconductor die and a plurality of circuits on said substrate, comprising:

• a substrate having a first die side surface for the attachment thereto of a portion of the surface having a plurality of bond pads of said plurality of bare semiconductor die, a second attachment surface having a plurality of bond pads located thereon for the connection of said plurality of bond wires thereto, a plurality of vias extending therethrough for said plurality of bond wires to extend therethrough from said plurality of bond pads of said plurality of bare semiconductor die, and a plurality of circuit traces for connection to said plurality of bond wires connected to said plurality of bond pads of said plurality of bare semiconductor die and for electrically connecting between said plurality of bare semiconductor die and said second substrate;
• and
• a plurality of electrical connectors located on the second attachment surface of the substrate for electrically connecting said substrate and said second substrate, the plurality of electrical connectors connected to the plurality of circuit traces.

An electrical assembly for connection to a substrate having a plurality of circuits comprising:

• a bare semiconductor die having a surface having a plurality of bond pads located thereon;
• a die substrate having a die side surface, an attachment surface, a via extending through the die substrate from the die side surface to the attachment surface, and a plurality of circuit traces, a portion of the surface having the plurality of bond pads of said bare semiconductor die attached to a portion of the die side surface of the die substrate;
• a plurality of wire bonds extending through the via extending through the die substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds connected to the plurality of bond pads of the bare semiconductor die and the plurality of circuit traces;
• and
• a plurality of electrical connectors located on the attachment surface of the die substrate for electrically connecting the die substrate and said substrate, the plurality of electrical connectors connected to the plurality of circuit traces.

The electrical assembly for connection to a substrate having a plurality of circuits comprising:

• at least two bare semiconductor die, each bare semiconductor die of the at least two bare semiconductor die having a surface having a plurality of bond pads located thereon,
• a die substrate having a die side surface, an attachment surface, at least two vias extending through the die substrate from the die side surface to the attachment surface, and a plurality of circuit traces, a portion of the surface having the plurality of bond pads of said each bare semiconductor die of the at least two bare semiconductor die attached to a portion of the die side surface of the die substrate;
• a plurality of wire bonds extending through each via of the at least two vias extending through the die substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds connecting the plurality of bond pads of said each bare semiconductor die of the at least two bare semiconductor die and the plurality of circuit traces of the die substrate;
• and
• a plurality of electrical connectors located on the die side surface of the die substrate for electrically connecting the die substrate and said substrate, the plurality of electrical connectors connected to the plurality of circuit traces.

An electrical assembly for connection to a substrate having a plurality of circuits comprising:

• a plurality of bare semiconductor die, each bare semiconductor die of said plurality of bare semiconductor die having a surface having a plurality of bond pads located thereon;
• a die substrate having a die side surface, an attachment surface, a plurality of vias extending through the die substrate from the die side surface to the attachment surface, and a plurality of circuit traces, a portion of the surface having the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die attached to a portion of the die side surface of the die substrate;
• a plurality of wire bonds extending through each via of the plurality of vias extending through the die substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds connecting the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die and the plurality of circuit traces of the die substrate, and
• a plurality of electrical connectors located on the die side surface of the die substrate for electrically connecting the die substrate and said substrate, the plurality of electrical connectors connected to the plurality of circuit traces.

An electrical assembly for connection to a substrate having a plurality of circuits comprising:

• a substrate;
• a bare semiconductor die having a surface having a plurality of bond pads located thereon,
• a die substrate having a die side surface, an attachment surface, a via extending through the die substrate from the die side surface to the attachment surface, and a plurality of circuit traces, a portion of the surface having the plurality of bond pads of said bare semiconductor die attached to a portion of the die side surface of the die substrate;
• a plurality of wire bonds extending through the via extending through the die substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds connected to the plurality of bond pads of the bare semiconductor die and the plurality of circuit traces;
• and
• a plurality of electrical connectors located on the attachment surface of the die substrate electrically connecting the die substrate and said substrate, the plurality of electrical connectors connected to the plurality of circuit traces.

An electrical assembly for connection to a substrate having a plurality of circuits comprising:

• a substrate;
• a plurality of bare semiconductor die, each bare semiconductor die of said plurality of bare semiconductor die having a surface having a plurality of bond pads, located thereon;
• a die substrate having a die side surface, an attachment surface, a plurality of vias extending through the die substrate from the die side surface to the attachment surface, and a plurality of circuit traces, a portion of the surface having the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die attached to a portion of the die side surface of the die substrate;
• a plurality of wire bonds extending through each via of the plurality of vias extending through the die substrate from the die side surface to the attachment surface thereof, the plurality of wire bonds connecting the plurality of bond pads of said each bare semiconductor die of said plurality of bare semiconductor die and the plurality of circuit traces of the die substrate;
• and
• a plurality of electrical connectors located on the die side surface of the die substrate electrically connecting the die substrate and said substrate, the plurality of electrical connectors connected to the plurality of circuit traces.