H05K 2203/0495
Cold welding
H05K2203/0495 (Cold welding) appears on 13 US grants and 7 published applications in this corpus.
Search patents in H05K- Granted patents
- 13
- Published applications
- 7
- Assignees
- 11
- Inventors
- 31
- Latest grant
- 4 May 2021
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 0 | 2 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
| 2018 | 0 | 1 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 2 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of wire bonding a first and second circuit card4 May 2021US 10,999,938 B1Raytheon Company
- Ultrasonic vibration bonding apparatus23 Mar 2021US 10,953,487 B2Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Electronic circuit boards fastened at a frame16 May 2017US 9,655,256 B2Hella KGaA Hueck & Co.
- Predeposited transient phase electronic interconnect media12 Oct 1999US 5,964,395 AFord Motor Company
- Connection structure between electrode pad on semiconductor device and printed pattern on printed circuit board16 Mar 1999US 5,883,432 ARicoh Company, Ltd.
- Method for manufacturing embedded trace substrate8 Oct 2026US 2026/0313809 A1Nissha Co., Ltd.
- Method and systems for cold forming features on flex circuits15 Feb 2024US 2024/0057250 A1Koninklijke Philips N. V.
- Ultrasonic vibration bonding apparatus27 Sep 2018US 2018/0272463 A1Toshiba Mitsubishi-Electric Industrial Systems Corporation
- Electrically conductive material28 May 2015US 2015/0146395 A1Lotes Co., Ltd
- Electrical connector28 May 2015US 2015/0147896 A1Lotes Co., Ltd
Most cited
By later US patents
- Flying leads for integrated circuits64US 5,195,237 ACray Computer Corporation · 1993
- Three dimensionally interconnected module assembly43US 5,045,975 ACray Computer Corporation · 1991
- Lead bonding of chips to circuit boards and circuit boards to circuit boards36US 5,054,192 ACray Computer Corporation · 1991
- Memory metal electrical connector35US 5,098,305 ACray Research, Inc. · 1992
- Predeposited transient phase electronic interconnect media31US 5,964,395 AFord Motor Company · 1999