Connection structure between electrode pad on semiconductor device and printed pattern on printed circuit board

A connection structure for connecting a semiconductor device and a printed circuit board, in which an electrode pad on the semiconductor device is connected with a printed circuit pattern on the printed circuit board, the connection structure comprising:

• a first metal bump formed on an electrode pad;
• a second metal bump formed on a printed circuit pattern,
• the electrode pad and the printed circuit pattern being arranged opposite each other and separated from each other by the first and second metal bumps,
• the electrode pad, the first and second metal bumps, and the printed circuit board forming a mounting structure;
• and
• sandwich materials having a top portion and a bottom portion for receiving and pressing the mounting structure therebetween to form a mounted body of the semiconductor device connected to the printed circuit board through the first and second metal bumps, wherein said sandwich materials are casinos which form part of an electrical apparatus in which the mounted body is included and hold the mounted body therein during use,
• wherein one of the first and the second metal bumps has a concave shape and the other of the first and the second first metal bumps has a convex shape.

A connection structure for connecting a semiconductor device and a printed circuit board, in which an electrode pad on the semiconductor device is connected with a printed circuit pattern on the printed circuit board, the connection structure comprising:

• a metal bump formed on an electrode pad;
• a plating layer formed on a printed circuit pattern;
• and
• sandwich materials, wherein
• the electrode pad and the printed circuit pattern are arranged opposite each other and are separated from each other through the metal bump and the plating layer to form a mounting structure, and
• the semiconductor device and the printed circuit board are sandwiched by the sandwich materials and pressed together by the sandwich materials to form a mounted body of the semiconductor device connected to the printed circuit board through the metal bump and the plating layer, wherein said sandwich materials are casings which from part of an electrical apparatus in which the mounted body is included and hold the mounted body therein during use.