Flying leads for integrated circuits

A method of fabricating from a length of metal wire a plurality of substantially equal length flying leads which are each attached to one of a corresponding plurality of bonding pads of an integrated circuit chip and which extend generally parallel to one another and at a predetermined angle from a surface of the integrated circuit chip, each lead being fabricated by steps comprising:

• forming a ball on an end of the metal wire by rapidly heating the end of the wire;
• forming an electrical and mechanical connection of the ball to the bonding pad by pressing the ball against the bonding pad of the chip;
• clamping the wire at a clamping location on the wire located above the surface of the chip;
• holding the chip;
• extending the wire substantially straight and at the predetermined angle form the surface of the chip between the connection and the clamping location;
• notching the connected wire at a notched location at a predetermined height above the surface of the chip and between the clamping location and the connection;
• applying force from the clamping location through the wire and the connection to the chip;
• and
• stretching the wire at a notched location by application of the force to server the wire at the notched location and to form the flying lead from the segment of the wire connected to the chip.