Three dimensionally interconnected module assembly

A circuit board module apparatus having electrical connections in the x, y, and z axis directions, comprising:

• an array of a plurality of circuit boards stacked in the z axis direction and coplanar in the x and y axis directions, each circuit board having a prefabricated conductor pattern, a plurality of unpackaged integrated circuit chips mounted to the conductor pattern of at least one circuit board, a plurality of power through-plated holes electrically connected to the conductor pattern of each circuit board, and a plurality of logic through-plated holes electrically connected to the conductor pattern of each circuit board;
• at least one power plate coplanar with and located along the z axis direction from said circuit boards and having a prefabricated conductor pattern for electrically distributing power, a plurality of through-plated holes electrically connected to the conductor pattern of the power plate, at least two of the through-plated holes on the power plate located substantially in respective axial alignment in the z axis direction with said power through-plated holes on said coplanar circuit boards;
• at least one logic board coplanar with and located along the z axis direction from said circuit boards and having a prefabricated conductor pattern for communicating electrical logic signals, a plurality of through-plated holes electrically connected to the conductor pattern of the logic board, at least two of the through-plated holes on the logic board located substantially in respective axial alignment in the z axis direction with said logic through-plated holes on said coplanar circuit boards;
• a plurality of electrically conductive z-axis power jumpers, each power jumper electrically connected to a through-plated hole on said power and an axially aligned power through-plated hole on said coplanar circuit boards;
• a plurality of electrically conductive z-axis logic jumpers, each logic jumper electrically connected to a through-plated hole on said logic boards and to an axially aligned logic through-plated hole on said coplanar circuit boards;
• a power input means for applying electrical power to the conductor pattern of said power plate;
• a spacer means for creating and maintaining a three dimensional circuit board module apparatus with said circuit board array, said power plate, and said logic board in a spaced, fixed, and superposed coplanar relationship;
• and
• said spacer means defining in conjunction with at least two of said boards or plates a fluid cooling channel for conducting non-electrically conducting liquid within said channel to remove heat from said circuit board module apparatus.

A three-dimensionally electrically interconnected circuit board module apparatus, comprising:

• a plurality of at least three boards oriented generally coplanarly in a plane defined by an x axis and a y axis, each of the boards located along a z axis, each board having a prefabricated electrical conductor pattern, one of the boards being a circuit board having at least one unpackaged integrated circuit chip mounted to the conductor pattern thereof, one of the other boards being a power board for conducting electrical power to said module apparatus, and one of the other boards being a logic board;
• a plurality of through-plated holes formed in each board and electrically connected to the conductor pattern of each board, at least some of the through-plated holes in two of the adjacent boards being axially aligned along the z axis;
• an electrically conductive z-axis power jumper electrically connecting a through-plated hole on the power board with an axially aligned through-plated hole on the circuit board to conduct electrical power from the power board to each integrated circuit chip mounted on the conductor pattern of the circuit board;
• and
• an electrically conductive z-axis logic jumper electrically connecting a through-plated hole on the logic board and to an axially aligned through-plated hole on the circuit board to conduct logic signals from each integrated circuit chip mounted on the conductor pattern of the circuit board.