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US 10,999,938 B1Granted
Method of wire bonding a first and second circuit card
AssigneeRaytheon Company
InventorsMikhail Pevzner, Donald G. Hersey, Gregory G. Beninati, Thomas J. Tellinghuisen, James E. Benedict
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Abstract
Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.
Claims5
A method, comprising:
- employing a first circuit card having first and second surfaces and including a first ball stack extending from the first surface of the first circuit card;
- employing a second circuit card having first and second surfaces and including a through hole, wherein the second circuit card is mated to the first circuit card to form an assembly, such that the first surface of the first circuit card faces the second surface of the second circuit card, wherein the first ball stack extends into the through hole;
- and
- employing a wirebond to connect the first ball stack to a bond pad on the first surface of the second circuit card, wherein the first and second ball stacks comprise at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.
1 more element
Dependencies are inferred from the claim text.