Ultrasonic vibration bonding apparatus

An ultrasonic vibration bonding apparatus, comprising:

• a substrate table on which a substrate is disposed;
• a bonding tool executing an ultrasonic vibration processing of applying ultrasonic vibration to an application portion on a lead wire having conductivity from a direct contact tip portion while applying predetermined pressure on a side of the substrate table in a state where the lead wire is disposed on the substrate;
• and
• first and second press mechanisms including first and second press rollers capable of performing a rotational operation, wherein
• the first and second press mechanisms execute
• a press processing of pressing both sides of the application portion on the lead wire by the first and second press rollers at a time of execution of the ultrasonic vibration processing by the bonding tool, and
• a movement processing of executing a rotational operation performed by the first and second press rollers to move the first and second press rollers on the lead wire while pressing the lead wire at a time of non-execution of the ultrasonic vibration processing by the bonding tool,
• the bonding tool and the first and second press mechanisms are physically connected,
• a contact state between the bonding tool and the lead wire is released during the execution of the movement processing,
• an extension direction of the lead wire is a predetermined direction,
• the bonding tool and the first and second press rollers are disposed along the predetermined direction, and
• the first and second press rollers are moved along the predetermined direction during the execution of the movement processing.