H05K 2203/043
Reflowing of solder coated conductors, not during connection of components
Official title: Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
H05K2203/043 (Reflowing of solder coated conductors, not during connection of components) appears on 630 US grants and 464 published applications in this corpus.
Search patents in H05K- Granted patents
- 630
- Published applications
- 464
- Assignees
- 247
- Inventors
- 1,301
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 6 | 0 |
| 1984 | 4 | 0 |
| 1985 | 2 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 2 | 0 |
| 1989 | 8 | 0 |
| 1990 | 7 | 0 |
| 1991 | 5 | 0 |
| 1992 | 12 | 0 |
| 1993 | 11 | 0 |
| 1994 | 13 | 0 |
| 1995 | 19 | 0 |
| 1996 | 20 | 0 |
| 1997 | 17 | 0 |
| 1998 | 20 | 0 |
| 1999 | 24 | 0 |
| 2000 | 28 | 0 |
| 2001 | 29 | 10 |
| 2002 | 29 | 23 |
| 2003 | 34 | 27 |
| 2004 | 21 | 29 |
| 2005 | 20 | 29 |
| 2006 | 17 | 44 |
| 2007 | 23 | 40 |
| 2008 | 27 | 36 |
| 2009 | 19 | 36 |
| 2010 | 26 | 25 |
| 2011 | 22 | 14 |
| 2012 | 22 | 17 |
| 2013 | 13 | 13 |
| 2014 | 13 | 8 |
| 2015 | 13 | 20 |
| 2016 | 11 | 11 |
| 2017 | 7 | 2 |
| 2018 | 10 | 12 |
| 2019 | 9 | 5 |
| 2020 | 7 | 13 |
| 2021 | 10 | 13 |
| 2022 | 10 | 7 |
| 2023 | 10 | 11 |
| 2024 | 11 | 8 |
| 2025 | 4 | 4 |
| 2026 | 2 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method of producing a surface finish on an electrically conductive substrate and electric conductor with the surface finish thereon5 May 2026US 12,620,510 B2TE Connectivity Germany GmbH
- Assembling method of electronic module28 Apr 2026US 12,615,720 B2Delta Electronics, Inc.
- Applying a solderable surface to conductive ink28 Oct 2025US 12,457,693 B2International Business Machines Corporation
- Solder preform assembly and methods of preforming solder for electronic board assembly30 Sep 2025US 12,432,863 B1Honeywell Federal Manufacturing & Technologies, LLC
- Reflow furnace12 Aug 2025US 12,385,694 B2Illinois Tool Works Inc.
- Method of forming an electronic assembly having a conformal coating, electronic assembly and film precursor to conformal coating8 Oct 2026US 2026/0313811 A1
- Electrically connecting a flexible circuit to a support structure27 Aug 2026US 2026/0255501 A1Teradyne, Inc.
- Shielded Connector Assembly With Frequency-Selective Slot Array20 Aug 2026US 2026/0246203 A1
- Electrical circuit forming method and electrical circuit forming device20 Aug 2026US 2026/0247540 A1Fuji Corporation
- Electronic module13 Aug 2026US 2026/0239542 A1Delta Electronics, Inc.
Most cited
By later US patents
- Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate244US 4,878,611 AAmerican Telephone and Telegraph Company, AT&T Bell Laboratories · 1989
- Surface mount solder assembly of leadless integrated circuit packages to substrates197US 5,346,118 AAT&T Bell Laboratories · 1994
- Method for fabricating an electronic device having solder joints186US 5,641,113 AOki Electronic Industry Co., Ltd. · 1997
- Solder ball connect pad-on-via assembly process181US 5,275,330 AInternational Business Machines Corporation · 1994
- Method for fabricating microbump interconnect for bare semiconductor dice166US 5,789,271 AMicron Technology, Inc. · 1998