Assembling method of electronic module
AssigneeDelta Electronics, Inc.
InventorsKun Jiang, Xi Liu, Xiaodong Chen
Life of this patent
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Abstract
An assembling method of an electronic module is disclosed and includes steps of: (a) providing a first circuit board including a first side and a second side; (b) providing a second circuit board including a third side and a fourth side, and a connection component connected to the third side; (c) providing a solder ball, and stacking the first circuit board, the second circuit board and the solder ball; and (d) performing a reflow soldering process to a stacked structure of the first circuit board, the second circuit board and the solder ball.
Claims19
An assembling method of an electronic module, comprising steps of:
- (a) providing a first circuit board including a first side and a second side opposite to each other;
- (b) providing a second circuit board including a third side, a fourth side and a connection component, wherein the third side and the fourth side are opposite to each other, and the connection component is disposed between the third side of the second circuit board and the second side of the first circuit board, wherein one end of the connection component is connected to the third side through a first reflow soldering process;
- (c) providing a solder ball, and stacking the first circuit board, the second circuit board and the solder ball, wherein the solder ball is placed on the fourth side;
- and
- (d) performing a second reflow soldering process to a stacked structure of the first circuit board, the second circuit board and the solder ball, wherein there is no solder ball placed on the third side of the second circuit board and the solder ball is not fixedly connected to the fourth side of the second circuit board before the second reflow soldering process.
An assembling method of an electronic module, comprising steps of:
- (a) providing a first circuit board including a first side and a second side opposite to each other;
- (b) providing a second circuit board including a third side, a fourth side and a connection component, wherein the third side and the fourth side are opposite to each other, and the connection component is disposed between the third side of the second circuit board and the second side of the first circuit board, wherein one end of the connection component is connected to the third side;
- (c) providing a solder ball, and stacking the first circuit board, the second circuit board and the solder ball, wherein the solder ball is placed on the fourth side;
- and
- (d) performing a reflow soldering process to a stacked structure of the first circuit board, the second circuit board and the solder ball, wherein there is no solder ball placed on the third side of the second circuit board and the solder ball is not fixedly connected to the fourth side of the second circuit board before the reflow soldering process.
Dependencies are inferred from the claim text.