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AssigneeHoneywell Federal Manufacturing & Technologies, LLC
InventorsTimothy Mark Force, Jr., Lucas Alan Mann, Bryan Alan Hildreth
Estimating the term…
Systems and methods for preforming solder on electrical components and completing solder joints between the electrical components and electronic boards are disclosed. In some embodiments, a preload assembly is provided. The preload assembly comprises a base configured with a base recess for receiving a shim and an inset plate. The inset plate comprises a plurality of preload holes configured to receive solder preloads and pins of the electrical components. The preload assembly may be run through a reflow process to bond the solder preload to the pin of the electrical component. Furthermore, the electrical component pin may then be inserted into a pinhole of an electronic board that has been prepared with additional solder preload. A second reflow process may complete the joint between the electrical component and the electronic board.
A method of preparing an electronic board with solder preloads using a preload assembly comprising a base and an inset plate, the method comprising:
A method of preparing an electronic board with solder preloads using a preload assembly comprising a shim, a base, and an inset plate, the method comprising:
A method of preparing an electronic board with solder preloads using a preload assembly comprising a base and an inset plate, the method comprising:
Dependencies are inferred from the claim text.