H05K 2203/042
Remote solder depot on the pcb, the solder flowing to the connections
Official title: Remote solder depot on the PCB, the solder flowing to the connections from this depot
H05K2203/042 (Remote solder depot on the pcb, the solder flowing to the connections) appears on 27 US grants and 15 published applications in this corpus.
Search patents in H05K- Granted patents
- 27
- Published applications
- 15
- Assignees
- 25
- Inventors
- 62
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 1 |
| 2003 | 0 | 0 |
| 2004 | 1 | 1 |
| 2005 | 2 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 1 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 1 |
| 2015 | 0 | 0 |
| 2016 | 1 | 2 |
| 2017 | 0 | 0 |
| 2018 | 1 | 2 |
| 2019 | 1 | 1 |
| 2020 | 1 | 1 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module14 Apr 2026US 12,604,391 B2Vitesco Technologies GmbH
- Method for void reduction in solder joints24 Nov 2020US 10,843,284 B2ZKW Group GmbH
- Printed circuit board and method for producing a printed circuit board18 Jun 2019US 10,327,325 B2ZK W Group GmbH
- Device for soldering electrical or electronic components25 Sep 2018US 10,081,069 B2ERSA GmbH
- Printed wiring board, printed circuit board, and method for manufacturing printed circuit board18 Oct 2016US 9,474,166 B2Canon Kabushiki Kaisha
- Circuit board for a power semiconductor module, power semiconductor module, and method for producing a circuit board and a power semiconductor module1 Aug 2024US 2024/0260168 A1Vitesco Technologies GmbH
- Printed wiring board and electronic device3 Mar 2022US 2022/0071021 A1Mitsubishi Electric Corporation
- Electronic control device30 Jul 2020US 2020/0243470 A1Hitachi Automotive Systems, Ltd.
- Motor-Vehicle Headlamp Having an SMD LED Attached by Soldering27 Jun 2019US 2019/0195448 A1ZKW Group GmbH
- Printed circuit board and method for producing a printed circuit board12 Jul 2018US 2018/0199425 A1ZKW Group GmbH
Most cited
By later US patents
- Circuit board to be precoated with solder layers and solder circuit board53US 5,453,582 AFurukawa Electric Co., Ltd. · 1995
- Solder plate reflow method for forming a solder bump on a circuit trace intersection52US 5,160,409 AMotorola, Inc. · 1992
- Controlled-shaped solder reservoirs for increasing the volume of solder bumps47US 6,392,163 B1Unitive International Limited · 2002
- Solder plate reflow method for forming solder-bumped terminals46US 5,194,137 AMotorola, Inc. · 1993
- Solder bump interconnection formed using spaced solder deposit and consumable path43US 5,282,565 AMotorola, Inc. · 1994