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AssigneeUnitive International Limited
InventorsGlenn A. Rinne, Paul A. Magill
Estimating the term…
A controlled-shaped solder reservoir provides additional solder to a bump in the step for increasing the volume of solder forming the solder bump. The controlled shaped reservoirs can be shaped and sized to provide predetermined amounts of solder to the solder bump. Thus, the height of the resulting solder bump can be predetermined. The solder reservoirs can be shaped to take a minimum amount of space, such as by at least partially wrapping around the solder bump. Consequently, the solder bumps may have increased height without adding to the space requirements of the solder bump, or without increasing the fabrication cost. In addition, due to the finite time required for solder flow, a means of sequencing events during soldering is provided.
A solder bump structure on a microelectronic substrate, comprising a solder structure including a solder reservoir portion and a solder bump portion, wherein said solder reservoir portion extends from said solder bump portion in a continuous line width gradient.
A solder bump structure on a microelectronic substrate, comprising a solder structure including a solder reservoir portion and a solder bump portion, wherein said solder reservoir portion at least partially wraps around said solder bump portion.
A solder bump structure on a microelectronic substrate, comprising a solder structure including a solder bump portion having a first width and a plurality of solder reservoir portions extending from said solder bump portion at least one of which has a second width which is less than said first width.
A solder bump structure on a microelectronic substrate, comprising a solder structure including a solder reservoir portion and a solder bump portion, wherein said solder reservoir portion includes a notch to facilitate removal of said solder reservoir portion from said microelectronic substrate.
A solder bump structure on a microelectronic substrate, comprising a solder structure including a solder reservoir portion and a solder bump portion, wherein said solder reservoir portion is non-linear and has a continuous line width.
Dependencies are inferred from the claim text.