Motor-Vehicle Headlamp Having an SMD LED Attached by Soldering
AssigneeZKW Group GmbH
InventorDaniel PETSCH
Life of this patent
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Abstract
The invention relates to a motor-vehicle headlamp (1), comprising at least one LED (4; 4a, 4d), which is attached by soldering, as an SMD, to metal surfaces (3-1, 3-2) of a printed circuit board (3) at connection points of said LED, and comprising an optical unit (2; 8), which emits the light emitted by the at least one LED into the traffic space, wherein, in order to set the emission direction of the at least one LED in a specific manner, said LED is attached by soldering with different solder thicknesses (d1, d2) between the connection points (4-1, 4-2) of said LED and the metal surfaces of the printed circuit board.
Claims5
A method for specifically setting the emission direction of at least one LED (4) in a motor vehicle headlamp (1), with at least one LED (4) soldered onto metal surfaces (3-1, 3-2) of a printed circuit board (3) with its connections (4-1, 4-2) as an SMD, wherein the metal surfaces are released by a solder resist (7), as well as with an optical unit that emits light emitted from the at least one LED into the traffic space, the method comprising:
- soldering the at least one LED (4) with different solder thicknesses (d1, d2) between its connections (4-1, 4-2) and the metal surfaces (3-1, 3-2) of the printed circuit board (3) in order to specifically set the emission direction thereof, wherein a quantity of solder (6-1) also extending onto the solder resist (7) is pressed onto the printed circuit board before the reflow process given a metal surface (3-1) that belongs to a connection (4-1, 4-2) with a larger solder thickness, so that once the solder has accumulated on the released metal surface, a height for the soldering gap (d1) sets in that is larger than for the metal surface (3-2) with a smaller solder thickness.
Dependencies are inferred from the claim text.