Printed wiring board, printed circuit board, and method for manufacturing printed circuit board

A printed circuit board comprising a printed wiring board, wherein the printed wiring board comprises a first surface layer on which an electronic component is mounted, wherein a heat transfer pattern is formed in an area of the first surface on which the electronic component is mounted, a second surface layer positioned on a side of the printed wiring board, opposite to the first surface layer, wherein a first conductive pattern is formed in an area of the second surface, and a through hole penetrating the printed wiring board in a thickness direction thereof, wherein the through hole is formed in the area in which the heat transfer pattern is formed, a through hole conductor is formed within the through hole, and the through hole conductor is thermally connected to the heat transfer pattern and the first conductive pattern;

• an electronic component having a heat sink mounted on the first surface layer of the printed wiring board;
• and a solder joint portion arranged between the heat sink of the electronic component and the heat transfer pattern of the printed wiring board, wherein the heat transfer pattern is covered with a solder resist, and is exposed from the solder resist to form a plurality of connecting lands, wherein the plurality of connecting lands comprise a first land group including a plurality of first lands, and a second land group including a plurality of second lands, each of the first lands is arranged adjacent to the through hole, and the each of the second lands is not arranged adjacent to the through hole;
• wherein the printed wiring board has at least one inner layer including a second conductive pattern arranged between the first and second surface layers, connected to the through hole.

A printed circuit board comprising a printed wiring board, wherein the printed wiring board comprises a first surface layer on which an electronic component is mounted, wherein a heat transfer pattern is formed in an area of the first surface on which the electronic component is mounted, a second surface layer positioned on a side of the printed wiring board, opposite to the first surface layer, wherein a first conductive pattern is formed in an area of the second surface, and a through hole penetrating the printed wiring board in a thickness direction thereof, wherein the through hole is formed in the area in which the heat transfer pattern is formed, a through hole conductor is formed within the through hole, and the through hole conductor is thermally connected to the heat transfer pattern and the first conductive pattern;

• an electronic component having a heat sink mounted on the first surface layer of the printed wiring board;
• and a solder joint portion arranged between the heat sink of the electronic component and the heat transfer pattern of the printed wiring board, wherein the heat transfer pattern is covered with a solder resist, and is exposed from the solder resist to form a plurality of connecting lands, wherein the plurality of connecting lands comprise a first land group including a plurality of first lands, and a second land group including a plurality of second lands, each of the first lands is arranged adjacent to the through hole, and the each of the second lands is arranged distant from the through hole rather than the first lands;
• wherein the printed wiring board has at least one inner layer including a second conductive pattern arranged between the first and second surface layers, connected to the through hole.